Each assembly is profiled thermally prior to production; ensuring the reflow process adheres to both solder manufacturer and customer’s specifications.
We are capable of placing a wide range of standard and odd-form SMD, from the smallest 0201 devices through CSPs, μBGAs, flip-chips and other components up to 38 mm x 38 mm, including 0.5 mm (20 mil) fine-pitch BGAs.
Maximum PCB size is 1200mm * 240mm
e.g. LED Tube、LED Bar.